Sn-3.5Ag-2Bi-0.7Cu无铅焊料压入蠕变性能的研究  

Research on Indentation Creep Property of Sn-3.5Ag-2Bi-0.7Cu Lead-Free Solder

作　　者：曾明[1,2] 陈正周[2] 沈保罗[1] 徐道芬[2] 廖春丽[2] 

机构地区：[1]四川大学,四川成都610064 [2]西华大学,四川成都610039

出　　处：《稀有金属材料与工程》2009年第8期1353-1357,共5页Rare Metal Materials and Engineering

基　　金：四川省教育厅"重点培育项目"(07ZZ033)

摘　　要：对Sn-3．5Ag-2Bi-0．7Cu无铅焊料在温度为50～100℃，应力为16．7-43．2MPa条件下的压入蠕变性能进行研究。得到压入蠕变的应力指数n=3．181、蠕变激活能Q=59．189kJ／mol、材料的结构常数A=0．423。获得Sn-3．5Ag-2Bi-0．7Cu无铅焊料稳态压入蠕变速率本构方程：ε=0．423σ^3.181exp（-59189／RT）。随着温度和应力的增加，Sn-3．5Ag．2Bi-0．7Cu无铅焊料的压入蠕变速率明显增加，蠕变后Ag3Sn、Cu6Sn5相明显变粗变短。Ag3Sn和Cu6Sn5可强化基体，提高β-Sn基体的抗压入蠕变性能。The indentation creep behaviour of Sn-3.5Ag-2Bi-0.7Cu lead-free solder was studied in the temperature range of 50-100℃ and indentation stress range of 16.7-43.2 MPa. The stress exponent n of 3.181, creep activation energy Q of 59.189 kJ/mol, and material structural constant A of 0.423 were obtained. The constitutive equation of the steady state indentation creep rate of the Sn-3.5Ag-2Bi-0.7Cu lead-free solder was ε=0.423σ^3.181exp（-59189/RT）. The experiment shows that the indentation creep rate increased dramatically as the temperature and stress increased. The Ag3Sn and Cu6Sn5 phases became coarser and shorter after indentation creep, which could increase indentation creep resisting property by strengthening β-Sn matrix.

关 键 词：Sn-3.5Ag-2Bi-0.7Cu 无铅焊料 压入蠕变 应力指数 激活能 

分 类 号：TG425.1[金属学及工艺—焊接] TG111.8