非晶硅微测辐射热计热学和力学仿真研究  

Simulation of Microbolometers Based on a-Si:H Thin Films with Thermal and Mechanical Performance

作　　者：龚宇光[1] 李伟[1] 蔡海洪[1] 李志[1] 陈超[1] 蒋亚东[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,成都610054

出　　处：《传感技术学报》2009年第8期1122-1126,共5页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金重点项目资助(60736005)

摘　　要：通过理论计算及有限元方法仿真研究微测辐射热计的热学和力学性能,得出了微桥桥腿尺寸与微桥的热导、热时间常数、桥面温升以及由微桥自身重力引起的位移形变的关系;提出了为了兼顾较好的热学和力学性能,需要选取合适的微桥桥腿尺寸的观点。以像元尺寸50μm×50μm的微桥结构为例,选取了非晶硅微测辐射热计理论上的最佳桥腿尺寸,得到桥腿的热导值5.05×10-7W/K,热时间常数1.18ms,桥面温升34.71mK,最大位移形变量3.62×10-4μm。The thermal performance and mechanical properties of a microbolometer was analyzed through theoretical calculating and finite elements simulation. The relationship between size of the micro-bridge and the thermal conductance, thermal time constant, temperature rise and displacement of bridge shape result from self-gravity were also obtained. In order to make an excellent effect on the microbolometer＇s performance, it is needed to select appropriate size of micro-bridge leg. The 50μm pixel-pitch of micro-bridge was analyzed as an example, and the appropriate size for micro-bridge legs was suggested at last, based on which the final properties can be obtained as thermal conductance of 5. 05 × 10^-7 W/K, thermal time constant of 1.18ms, temperature rise of micro-bridge surface of 34. 71mK and maximum displacement of 3. 62 × 10^-4μm.

关 键 词：非晶硅 微测辐射热计 有限元分析 热学性能 力学性能 

分 类 号：TN215[电子电信—物理电子学]