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作 者:杨磊[1]
机构地区:[1]中国电子科技集团公司第43研究所,合肥230022
出 处:《混合微电子技术》2009年第2期30-35,共6页Hybrid Microelectronics Technology
摘 要:本文系统研究了表面预处理、镀液配方及电镀工艺对电子元器件金属外壳耐蚀性能的影响。结果表明,采用化学抛光溶液抛光和超细粉喷刷两种技术联合进行基体表面处理,使基体的光洁度得到明显改善,更易获得致密的镀层;镍层厚度的增加能明显提高镀层的抗盐雾能力,但过厚的镀镍层会使金属外壳的引线抗弯疲劳性能下降;T镍镀液和T金镀液能使镀层更均匀和致密,从而显著改善电镀层的抗腐蚀性能以及抗疲劳性。The corrosion resistance properties of metal electronic package units were studied by salt fog experiments after the metal unit experienced different surface pre - treatments and different electropating processes of nickel and gold. The results show that the roughness of the surface of the metal package was remarkably improved by chemical solution polishing associated with ultro - fine powder spray polishing, which made the plating layer more compact; the ablity of salt fog resistance of the plating layer increased with its thickness, too thick plating layer make the bending fatigue resistance ability of the down - lead line from the metal package decrease; T type nickel plating solution and T type gold plating solution can both make the layer more even and more compact which made the corrosion resistance and lead bending fatigue of the metal package improved.
分 类 号:TG174.44[金属学及工艺—金属表面处理]
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