Ag_3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响  

MODELING OF Ag_3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER

作　　者：王小京[1] 祝清省[1] 王中光[1] 尚建库[1,2] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室,沈阳110016 [2]Department of Materials Science and Engineering,University of Illinois at Urbana-Champaign

出　　处：《金属学报》2009年第8期912-918,共7页Acta Metallurgica Sinica

基　　金：国家重点基础研究发展计划资助项目2004CB619306~~

摘　　要：本文用位错蠕变模型,描述了在电流作用下,无铅焊料Sn-Ag-Cu(SAC)中第二相粒子-Ag_3Sn的粗化过程及其对蠕变速率的影响.模型中焊料组织被简化为:β-Sn母相基体和在基体上弥散分布的Ag_3Sn第二相粒子.基于Lifshitz-Wagner理论,得到了描述第二相粒子尺寸演化的关系式,式中包括稳态应变和电流作用引起的两部分组化.Coarsening of the microstructure in Sn-Ag-Cu （SAC） solder joints under current stressing was observed experimentally and modeled by a dislocation-creep model which incorporates the coarsening of second phase particles in lead-free solder alloys. Both the effects of electric current and strain enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic-strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends.

关 键 词：无铅焊料 粒子粗化 电流 

分 类 号：TB302.3[一般工业技术—材料科学与工程] TB303