微米金刚石对电子绝缘封装胶导热性的改进(英文)  

Improved Heat-Dissipating electrical insulator encapsulation gel By Micro-diamonds

作　　者：张明昌[1] 曹美玲[2] 潘丽坤[1] 秦易[3] 孙卓[1] 

机构地区：[1]华东师范大学物理系纳光电集成与先进装备教育部工程中心,上海200062 [2]华东师范大学化学系纳光电集成与先进装备教育部工程中心,上海200062 [3]华东师范大学电子科学与技术系纳光电集成与先进装备教育部工程中心,上海200062

出　　处：《功能材料与器件学报》2009年第4期375-378,共4页Journal of Functional Materials and Devices

基　　金：Shanghai Natural Science Foundation(No.07ZR14033);Shanghai Pujiang Program(No.08PJ14043);Special Project for Nanotechology of Shanghai(No.0752nm011);Applied Materials Shanghai Research & Development Fund(No.07SA12)

摘　　要：本文采用微米金刚石的掺杂改进电子绝缘封装胶的导热性能,制备了高导热的电子绝缘封装胶微米复合材料。用扫描电镜对微米金刚石复合材料的截面进行了表征。结果表明微米金刚石的掺杂能够很好的和电子绝缘封装胶进行结合,没有产生明显的两相分离,在电子绝缘封装胶中形成了良好的导热网络。用HOTDISK热常数测试仪对所制备的微米复合材料进行了导热系数的测量,结果表明,随着微米金刚石掺杂量的增加,复合材料的导热系数k有明显的提高。与纯电子绝缘封装胶的导热系数为0.24W/m*К相比,当微米金刚石掺杂量的质量百分比为12.5%时,复合材料的导热系数比纯电子绝缘封装胶的导热系数提高了29.2%。Micro - diamonds were introduced into electrical insulator encapsulation gel to investigate their effect on the thermal conductivity. Microstructure studies by a scanning electron microscope showed that the microdiamonds could be better dispersed in the matrix. No notable phase separation between the micro - diamonds and electrical insulator encapsulation gel matrix were observed. The thermal conductivities of the composites were measured by the Hot Disk Thermal Constants Analyser. The thermal conductivity k was found to increase with the micro - diamonds filler loading. There was a 29.2% enhancement in thermal conductivities for electrical insulator encapsulation gel with 12.5 wt% micro - diamonds loading, as compared with 0.24W/m ＊ K for the pure electrical insulator encapsulation gel.

关 键 词：微电子封装 导热系数 微米金刚石 

分 类 号：TB34[一般工业技术—材料科学与工程]