线路板印刷用Cu纳米粒子的研究进展  

Developments Progress of Cu Nano-particle for Printed Circuit Board

作　　者：王龙[1] 

机构地区：[1]中山火炬职业技术学院,中山528436

出　　处：《包装工程》2009年第9期111-113,共3页Packaging Engineering

基　　金：中山市科技计划项目(20083A256)

摘　　要：综述了电路印刷油墨用Cu纳米粒子在合成表征及应用方面的研究现状和发展趋势,并从工艺角度对其工业化生产做出了简要分析;归纳了电路板印刷油墨用Cu纳米粒子抗氧化技术进展;展望了今后印刷电子电路中Cu纳米导电材料的研究方向。The status and progress of the syntheses, characterization and antioxidant of Cu nano-material for printed circuit board was summarized. The industrialization of Cu nano-material was analyzed from the aspect of process. The technical progress of antioxidation of Cu nano material for printed circuit board was concluded. The research direction of Cu nano-material for printed circuit board put forward.

关 键 词：Cu纳米粒子 印刷电路 抗氧化 进展 

分 类 号：TS852[轻工技术与工程]