基于Maxwell模型的树脂系基板中埋置电容研究  

Study on Embedded Capacitor in FR4 Substrate Series Based on Maxwell Model

作　　者：潘开林[1] 丘伟阳[1] 袁超平[1] 刘静[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《半导体技术》2009年第9期852-856,共5页Semiconductor Technology

基　　金：国家自然科学基金(600866002);广西制造系统与先进制造技术重点实验室主任课题基金(0842006-018-Z)

摘　　要：采用Maxwell模型描述树脂系基板中埋置电容的黏弹性变形行为,获得了埋置电容及阻焊膜的Maxwell模型本构方程。对埋置式基板进行了有限元仿真,重点分析了其中的埋置电容在加速温度循环条件下的热机械变形,得出埋置电容变形分布是从其两侧边角位置向内变形量逐渐增大,中间两侧边缘处变形最大,研究了热机械变形对埋置电容的电容量的影响,在此基础上针对典型滤波电路分析了电容量变化对电路可靠性的影响。结果表明,Maxwell模型可以合理描述埋置电容的变形行为并可用于分析系统封装中黏弹性材料可靠性及为埋置无源器件电性能分析提供了参考。The Maxwell model was applied to describe the viscoelastic behavior of an embedded capacitor in the FR4 substrate series, and the constitutive equations of Maxwell model were obtained to calculate the viscoelastic deformation of embedded capacitor and solder mask. 3D embedded substrate module was analyzed with finite element method. The thermo-mechanical deformation of embedded capacitor was investigated under accelerated thermal cycle. The results show that the maximum displacement takes place at the both sides of the middle edges. The thermo-meehanical deformation of embedded capacitor is the dominant reason, which leads to the changes of capacitance. Then the effect of changes in the electrical parameters of the embedded capacitors due to thermo-mechanical deformation on the system performance of low-pass filters was studied to provide guidelines for reliable embedded passives with maximum performance. The results represent the Maxwell model can be applied to study the reliability of viscoelastic material in SIP （system in package） system, and analyze the electrical performance of embedded passives.

关 键 词：Maxwell模型 埋置电容 黏弹性 系统封装 热机械变形 

分 类 号：TM532[电气工程—电器]