溴化N-乙烯基-N′-丁基咪唑盐-丙烯酸乙酯共聚物对电镀铜层性能的影响  

Effect of Poly(N-Vinyl-N'-Butylimidazoliniumbromize-co-Ethyl Acrylate) on the Electrochemical Behavior of Electroplated Copper Coating

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作  者:刘小平[1] 刘勇[1] 唐有根[1] 王海波[1] 

机构地区:[1]中南大学化学化工学院化学电源与材料研究所,湖南长沙410083

出  处:《材料保护》2009年第9期22-23,29,共3页Materials Protection

摘  要:目前,以溴化N-乙烯基-N′-丁基咪唑盐-丙烯酸乙酯共聚物(QVI-EA)为酸性镀铜添加剂的研究较少。为此,将自制的QVI-EA作添加剂,用于酸性镀铜。通过阴极极化曲线、循环伏安测试了其电化学性能,采用金相显微镜和扫描电子显微镜分别对镀层表面形貌进行分析。结果显示,自制的QVI-EA对铜离子在阴极还原有很强的极化作用,使铜离子在电解液中的还原电位降低了约0.1V;酸性镀铜槽液中添加该化合物可获得颗粒细致、光亮平整的镀层。The effect of poly(N-vinyl-N'-butylimid-azoliniumbromize-co-ethyl acrylate,QVI-EA)as an additive for acidic copper electroplating on the electrochemical behavior of Cu coating was investigated by measuring cathodic polarization curve and conducting cyclic voltammetric analysis as wall.The mor-phology of the Cu coating was observed using a metallographic mi-croscope and scanning electron microscope.Results indicate that the copolymer can greatly promote the cathodic polarization of copper ions and decrease the reduction potential of copper ions in electrolyte by 0.1 V.It is feasible to prepare bright and smooth Cu coating with fine particles by introducing the co-polymer addi-tive into the bath for acidic copper electroplating.

关 键 词:电镀添加剂 酸性镀铜层 溴化N-乙烯基-N’-丁基咪唑盐-丙烯酸乙酯共聚物 电化学性能 

分 类 号:TQ153.14[化学工程—电化学工业]

 

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