Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性  

Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate

作　　者：张晓瑞[1,2] 汪春雷[3] 赵宏欣[1] 李建强[1] 袁章福[1] 

机构地区：[1]中国科学院过程工程研究所多相复杂系统国家重点实验室,北京100190 [2]中国科学院研究生院,北京100049 [3]北京科技大学冶金与生态工程学院,北京100083

出　　处：《过程工程学报》2009年第4期829-832,共4页The Chinese Journal of Process Engineering

基　　金：国家自然科学基金资助项目(编号:50474043);多相复杂系统国家重点实验室开放基金资助项目(编号:0825029)

摘　　要：采用静滴法对Sn-Zn,Sn-Ag-Cu,Sn-Bi-Cu锡基合金在铜基板上的润湿性进行了研究.结果表明,Sn-Bi-Cu合金的润湿性良好,Sn-30Bi-0.5Cu合金在530K时的接触角为26o,熔融的Sn-3Ag-0.5Cu共晶合金的接触角几乎不存在滞后性.锡基合金中添加Bi元素可提高合金的润湿性,添加Cu元素可有效防止溶铜发生.研究结果为无铅焊锡合金的应用提供了一定的理论依据.The wettability of Sn-Zn,Sn-Ag-Cu,Sn-Bi-Cu solder alloys on copper substrate was measured by sessile drop method.Among these solder alloys studied,the wettability of Sn-Bi-Cu alloy was excellent,at 530 K the contact angle between Sn-30Bi-0.5Cu alloy and Cu substrate was 26o.There was almost no contact angle hysteresis of the molten ternary eutectic Sn-3Ag-0.5Cu alloy.Adding Bi to Sn-based alloys could improve the wettability of alloys,while adding Cu could prevent the occurrence of dissolution of Cu substrate effectively.These research results may provide some theoretical basis for the use of lead-free solder alloys.

关 键 词：无铅焊料 润湿性 接触角 滞后性 界面层 

分 类 号：TG425[金属学及工艺—焊接]