化学镀铜工艺中内层铜的可靠性  

Innerlayer Copper Reliability of Electroless Copper Processes

作　　者：王以平 

出　　处：《印制电路信息》2009年第9期19-21,50,共4页Printed Circuit Information

摘　　要：文章作者CrystalLi是罗门-哈斯电子材料亚洲有限公司(香港)电路板技术集团的研究技师。文章主要介绍化学镀铜过程中-目前做通孔或盲孔金属化最常用的制程,可能会影响PCB互联缺陷的一些因素。印制电路板的绝缘材料,其热膨胀系数高于铜材料。因此当焊接使温度升高时,介质的延展大大超过铜的延展。因此,导致增加的应力加到了内层互连的各个表面上。镀铜的通孔和内层铜之间必须要有非常强的结合力,才能使PCB成功地发挥其作用。如果化学镀铜和铜之间或内层化学镀铜和电解铜之间的结合力非常差,热应力就会导致互连缺陷(ICD)发生。The author of this article Crystal Li is a Research Technologist in the Circuit Board Technologies Group of Rolun and Haas Electronic Materials Asia Ltd.（Hong Kong）. This paper describes some of the factors within the electroless copper process that may influence ICD performance. Electroless copper remains the most usual process employed to make the dielectric surfaces of holes/vias. Dielectric materials used in PCB＇s have higher coefficients of thermal expansion than copper. As a result, when the board temperature rises （for example, during soldering）, the dielectric expands more than copper. Within a through hole, this leads to an increase in the stress applied to the innerlayer interconnect surfaces. Very strong adhesion between the copper plated in the through hole and the innerlayer copper is essential to successful board function. If the adhesion between the electroless copper and the innerlayer copper or between electroless copper and electrolytic copper is weak, thermal stresses may lead to the formation of interconnect defects （ICD）.

关 键 词：可靠性 内层 化学镀铜 

分 类 号：TN41[电子电信—微电子学与固体电子学] TQ153.14[化学工程—电化学工业]