无机填料对淀粉胶性能的影响  

Effects of inorganic fillers on properties of starch adhesive

作　　者：郝王勋[1] 张钦发[1] 郑羽茜[1] 

机构地区：[1]华南农业大学食品学院,广东广州510642

出　　处：《粘接》2009年第9期65-67,共3页Adhesion

摘　　要：以斯坦霍尔2步法制备的玉米淀粉胶为研究对象,试验了3种无机填料对淀粉胶稳定性、黏度以及制备的瓦楞纸板在普通环境和潮湿环境中的边压强度和粘合强度的影响。结果表明,加入无机填料可以大幅度提高淀粉胶稳定性;以加入适当无机填料A的淀粉胶制作的瓦楞纸板的边压强度有较大提高。The modified starch adhesive was prepared using Stein Hall method and the corrugated cardboard was obtained with the modified adhesive.The effects of three different inorganic fillers on stability and viscosity of modified starch adhesive, the edgewise crush resistance and adhesion strength of the corrugated cardboard stored in normal or moist environmet were investigated.The results showed that addition of inorganic filler can maintain the adhesive stabity. Adding the inorganic filler A, the modified starch adhesive can make the edgewise crush resistance of corrugated cardboard increased significantly.

关 键 词：无机填料 瓦楞纸板 淀粉粘合剂 

分 类 号：TQ432.2[化学工程]