酸性镀铜体系的交流阻抗研究  

Studies on Impedance of Acidcopper Electroplating System

作　　者：邓文[1] 刘昭 林项民 郭鹤桐[2] 

机构地区：[1]湘潭工学院化工系 [2]天津大学应化系

出　　处：《电化学》1998年第2期152-158,共7页Journal of Electrochemistry

摘　　要：研究了基础溶液（０．３ｍｏｌ／ＬＣｕＳＯ４＋１．９４ｍｏｌ／ＬＨ２ＳＯ４），以及添加６０ｍｇ／ＬＣｌ－，３００ｍｇ／ＬＯＰ２１，３０ｍｇ／ＬＰＥＧ６０００，１０ｍｇ／Ｌ２噻唑啉基二硫丙烷磺酸钠（代号ＴＤＹ，自合成添加剂）后体系的阻抗行为．结果表明：１）Ｃｌ－在铜沉积中有增大阴极极化的作用．２）铜离子的放电为分步反应，即Ｃｕ２＋→Ｃｕ＋；Ｃｕ＋→Ｃｕ（吸附）→Ｃｕ（晶格），在含有Ｃｌ－离子和不含Ｃｌ－的溶液中，Ｃｕ２＋离子以不同的络合离子形式放电．３）Ｃｕ沉积反应的阻抗行为存在弥散效应．The impedance characteristics of elementary solution (0.3 mol/L CuSO_4+1.94　mol/L　H_2SO_4) and that with the addition of 60 mg/L Cl^-, 300 mg/L OP_21, 30 mg/L PEG, 10 mg/L 2thiazolinyldithiopropane sulfate(self-synthesized additive) are investigated and interpreted in terms of equivalent circuit. The results indicated: (1) Cl^- ion can increase cathodic polarization. (2) A twostep reaction mechanism corresponds to Cu^2+ reduction, that is: Cu^2+→Cu^+, Cu^+→Cu(adsorption)→Cu(lattice), Cu^2+ react in different forms of complex ion in sulfuric acidcupric sulfate solution with or without Cl^- ion. (3) cupric redution impedance shows dispersion effect in the solution that contains Cl^- ion.

关 键 词：酸性镀铜体系 电化学 交流阻抗 镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]