纯铜表面纳米化对Ti离子注入的影响  

Influence of surface nanocrystalline of copper on Ti ions implantation

作　　者：林万明[1] 卫英慧[1] 杜华云[1] 毕海香[1] 侯利锋[1] 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《功能材料》2009年第9期1552-1554,共3页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(50471070);山西省留学回国人员科研资助项目(2006-32)

摘　　要：为了改善金属材料表面的综合性能,将表面改性技术和纳米技术相结合逐渐得到了人们的重视。用金属蒸气弧(MEVVA)源离子注入机,将能量为40keV,剂量为2×1017ions/cm2的Ti离子注入纳米纯铜中。利用透射电子显微镜(TEM)、X射线衍射仪(XRD)、俄歇电子能谱(AES)对表层组织及注入浓度分布等进行了分析。研究结果表明,纯铜表面经过SMAT纳米化处理后,注入元素的浓度呈现高斯分布,与未处理的样品相比,峰值浓度提高了30%,注入深度达到160nm。To modify the surface properties of metal materials, more and more researches focus on the combination of surface modification and nanotechnology. Titanium ions were implanted into the copper by using MEVVA. Titanium implantation was carried out at the chosen ion doses 2 × 10^17 ions/cm^2 and the energy of 40keV. The surface microstructure and concentration distribution of implanted ions were characterized by using transmission electron microscope （TEM）, X-ray diffraetometer （XRD）, Auger electron spectroscopy （AES）. The results showed that the titanium element followed Gauss distribution and its maximal concentration of 25 % appeared at the depth of 45nm with the deepest implantation of more than 160nm.

关 键 词：表面纳米化 离子注入 铜 

分 类 号：TG178[金属学及工艺—金属表面处理]