微电子封装外壳电镀前处理述评  

A Review of Pretreatment of Microelectronics Packages for Electroplating

作　　者：张志谦[1] 刘圣迁[1] 

机构地区：[1]河北半导体研究所,河北石家庄050051

出　　处：《电镀与精饰》2009年第9期20-22,29,共4页Plating & Finishing

摘　　要：讨论了微电子封装外壳电镀前处理不良引起的镀层质量问题,特别对封装外壳污染物的种类以及污染程度的影响提出了相应的前处理措施。为了弥补常规前处理方法的不足、对目前普遍使用的非常规处理方法及其应用情况作了简要的评述。The coating quality problems, which were caused by improper pretreatment for electroplating of the microelectronics packages, are discussed in the paper. The impact of the pollutant categories and the pollution extent on the pretreatment are discussed and the countermeasure for this is proposed. In order to improve the coating quality by using the conventional pretreatment methods, some unconventional treatment methods as well as their applications are briefly reviewed.

关 键 词：微电子封装外壳 镀前处理 非常规处理 镀层质量 

分 类 号：TQ153[化学工程—电化学工业]