钢铁件HEDP直接镀铜工艺开发30年回顾 第一部分——开发历程与近30年来的改进  

Review of HEDP direct copper plating process on iron and steel workpiece after 30 years of development—Part I. History and recent 30 years of improvement

作　　者：方景礼 

机构地区：[1]福州锘钡尔表面技术有限公司,福建福州350003

出　　处：《电镀与涂饰》2009年第9期7-9,19,共4页Electroplating & Finishing

摘　　要：本文分3部分刊出。第一部分回顾了国内钢铁件HEDP直接镀铜工艺的开发历程以及国内外HEDP无氰镀铜的工业应用状况。分析了HEDP、柠檬酸盐、焦磷酸盐和氰化物作为碱性镀铜配位剂的优缺点。结合近30年来的生产实践,认为HEDP还是目前碱性无氰镀铜的首选配位剂。This paper is to be published in three parts. In the first part, the development history of HEDP direct copper plating process in China and its industrial applications at home and aboard were reviewed. The advantages and disadvantages of chelating agents HEDP, citrate, pyrophosphate and cyanide used for alkaline copper plating were analyzed, based on 30 years of production practice. It is considered that, for the time being, HEDP is the preferred chelating agent for alkaline copper plating in replace of cyanide.

关 键 词：钢铁 镀铜 1-羟基乙叉-1 1-二膦酸 配位剂 

分 类 号：TQ153.14[化学工程—电化学工业]