SPS工艺对铜/金刚石复合材料性能的影响  

Effect of spark plasma sintering process on the properties of Cu/diamond composite material

作　　者：张毓隽[1] 童震松[1] 沈卓身[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《电子元件与材料》2009年第10期37-40,共4页Electronic Components And Materials

摘　　要：采用SPS(放电等离子烧结)工艺制备了高体积分数铜/金刚石复合材料,研究了SPS中主要的工艺参数烧结温度、保温时间和烧结压强对复合材料相对密度和热导率的影响。结果表明:最佳的烧结温度为930℃;热导率和相对密度随保温时间延长有所提高,20min后趋于稳定;而随烧结压强由10MPa提高到70MPa,热导率约上升15%。经过优化工艺后,所制备的铜/金刚石复合材料最高热导率达到354.1W(m.K)–1,最高相对密度为98.4%。High volume fraction Cu/diamond composite material was successfully prepared by spark plasma sintering（SPS） process. The effect of the sintering temperature, soaking time and sintering pressure on the relative density and thermal conductivity （TC） of the composite material were discussed. The results show that the best sintering temperature is 930℃. The relative density and TC increase discontinuously with soaking time prolongation and tend to stabilization after 20 min. While the sintering pressure increases from 10 MPa to 70 MPa, the TC of composite material increases about 15%. In optimum process conditions, the TC and relative density of the composite material reach 354.1 W（m·K）^-1 and 98.4%, respectively.

关 键 词：铜/金刚石复合材料 SPS 热导率 相对密度 

分 类 号：TB333[一般工业技术—材料科学与工程]