硫醇化合物在银盐CTP版材上的疏水作用  

INFLUENCE OF A THIOL COMPOUND ON THE HYDROPHOBICITY OF CTP PLATE

作　　者：周树云[1] 陈萍[1] 钱志国[1] 郑德水[1] 

机构地区：[1]中国科学院感光化学研究所

出　　处：《感光科学与光化学》1998年第4期321-325,共5页Photographic Science and Photochemistry

基　　金：国家自然科学基金

摘　　要：本文采用线形ＣＣＤ（ＣｈａｒｇｅＣｏｕｐｌｅｄＤｅｖｉｃｅ）技术、接触角等方法研究了一种长链硫醇化合物对计算机直接制版材料物理显影动力学及疏水性能的影响．结果表明，该化合物是物理显影过程的抑制剂，在显定合一的加工液中添加该化合物可以显著提高版材物理显影银区的疏水性能．同时，通过表面显微拉曼光谱进一步证明了硫醇化合物在物理显影银表面的吸附增加了版材的亲油性．The influence of a thiol compound on the physical development and the hydrophobicity of CTP plate was studied by using CCD technique and measuring contact-angle. The results showed that the thiol compound was an inhibitor for physical development on the CTP plate, while it could greatly enhance the hydrophobicity of the plate. Raman spectra revealed that the long hydrocarbon chains of the thiol compound formed an oleophylic film on the surface of the developed silver on the CTP plate.

关 键 词：硫醇化合物 CTP版材 计算机 制版 银盐 疏水 

分 类 号：TQ577.26[化学工程—精细化工] TS802.6[轻工技术与工程]