无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测  

DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE

作　　者：王强[1] 刘勇[1] 梁利华[1] 

机构地区：[1]浙江工业大学机电工程学院,浙江杭州310014

出　　处：《工程力学》2009年第10期177-182,共6页Engineering Mechanics

基　　金：国家自然科学基金项目(10372093);浙江省自然基金项目(Y107365)

摘　　要：在不同的温度和常应变率条件下,对无铅焊料95.7Sn3.8Ag0.5Cu进行不同的温度和应变率条件下的拉伸试验,采用非线性数据拟合方法,得到材料的Anand本构模型参数。基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命,对无铅材料95.7Sn3.8Ag0.5Cu和含铅材料62Sn36Pb2Ag的CSP焊点寿命进行了预测和比较,结果表明无铅材料95.7Sn3.8Ag0.5Cu的疲劳寿命比含铅材料62Sn36Pb2Ag的寿命高30.93%。A series of tensile tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu have been conducted under a wide range of temperatures and constant strain rates. A procedure for the determination of Anand material parameters through data fitting is proposed to find nine constants. Three-dimensional finite element analysis has been applied to predict the fatigue life of solder joints under thermal cycling conditions. Finally the life of CSP solder joint based on Pb-free material 95.7Sn3.8Ag0.5Cu and that based on standard Pb material 62Sn36Pb2Ag are predicted and compared. It can be found that the fatigue life based on 95.7Sn3.8Ag0.5Cu is 30.93% longer than that based on 62Sn36Pb2Ag.

关 键 词：无铅材料 粘塑性 CSP 焊点可靠性 寿命预测 

分 类 号：O346[理学—固体力学]