硅微机械陀螺表头温度特性研究与测试  

Research and Test on Silicon Micro-Gyroscope Temperature Characteristics

作　　者：夏国明[1] 王寿荣[1] 杨波[1] 

机构地区：[1]东南大学仪器科学与工程学院,江苏南京210096

出　　处：《测控技术》2009年第9期9-13,共5页Measurement & Control Technology

摘　　要：硅微机械陀螺目前已经能达到较高的精度,但温度的变化对它的性能有较大的影响。为了改善硅微机械陀螺的温度性能,从硅微机械陀螺的基本原理入手,通过分析及测量微机械表头的传递函数中各个参数随温度的变化规律以及它们对陀螺性能的影响,找到了影响陀螺温度性能的关键参数和改进方法,对陀螺的微结构设计和陀螺的温度补偿电路设计都有重要的指导意义。The silicon MEMS gyroscope has reached a good performance, but there is a large drop in its performance when temperature changes. To improve the gyroscope＇ s performance in vary temperature, using the basic principle of gyroscope, how the parameter of the gyroscope＇ s transfer function changes with temperature and how it affects the performance of the gyroscope are introduced, finally, the key parameters and how to improve them are finded. The result has important guiding significance to the micro-structure design and gyro temperature compensation circuitry design.

关 键 词：硅微机械陀螺 温度特性 微小电容测量 

分 类 号：TP202.7[自动化与计算机技术—检测技术与自动化装置]