基于PDMS纳米粒子改性的热模压技术  

Mechanical modification of PDMS by blending with nano particles as hot embossing mold

作　　者：汪鹏[1] 陈翔[1] 肖丽君[1] 朱军[1] 陈迪[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细技术教育部重点实验室,上海200030

出　　处：《功能材料与器件学报》2009年第5期441-446,共6页Journal of Functional Materials and Devices

基　　金：国家863资助项目(2007AA04Z310);微米/纳米加工技术国家重点实验室基金(9140C7903060706)

摘　　要：介绍了一种采用纳米SiO2、TiO2改性聚二甲基硅氧烷(PDMS)的方法,研究了两种纳米材料SiO2、TiO2添加的比例对热压效果的影响及优化条件,并分析了其改性后的热膨胀系数及杨氏模量的变化,以及其改性后热压效果的提高进行了初步分析,最后用改性的PDMS材料,快速成型来制造热压模具,热压制作聚甲基丙烯酸甲酯(PMMA)微流控芯片。与常用的金属模具(如镍模具)相比,此方法具有脱模容易,工艺周期短,难度低,重复性好,价格低等优点。A simple method was presented to fabricate tool for hot embossing by modifying PDMS （polydimethylsiloxane） with nano particles, such as SiO2, TiO2. The effect of the mix ratio of PDMS and these two kinds of nano particles on hot embossing as well as the optimum conditions was investigated. In order to improve the efficiency of hot embossing, primary analysis was made by analyzing the variation of Young＇s modulus and thermal coefficient expansion of modified PDMS which were studied by thermal analyzer. This modified PDMS was used to fabricate mold by rapid prototyping, which was then used to fabricate polymethyl methacrylate （PMMA） mircofludic chips by hot embossing. Compared with the conventional hot embossing mold, such as metal mold and silicon mold, this modified PDMS mold is of excellent duplicate of microstructures, very rapid, low cost, and reduction in complexity, what＇s more, the molds are released easily, and have has a good reproducibility.

关 键 词：PDMS改性 纳米粒子 热模压 微流控 

分 类 号：O484.4[理学—固体物理]