拆解芯片的可重用性研究  

Investigation into Reusability of Disassembled Chip

作　　者：郭秀盈[1,2] 向东[1] 段广洪[1] 杨继平[1] 丁晓宇[1] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084 [2]天津理工大学电子信息工程学院,天津300191

出　　处：《微电子学》2009年第5期714-717,共4页Microelectronics

基　　金：国家科技支撑计划资助项目(2006BAF02A16)

摘　　要：对实验室自主研发的电路板无损拆解机拆解所得芯片的可重用性进行了分析研究。研究表明,潮气是导致拆解过程中芯片分层的主要因素;芯片分层问题可以通过电路板充分干燥后再进行拆解得到解决;破坏性物理分析(DPA)表明,正常使用4～5年的芯片内部没有出现明显的蠕变、腐蚀等可能导致芯片潜在失效的因素,拆解芯片具有较高的可重用价值。Reusability of chips disassembled by our self-developed diassembling machine was investigated. Results showed that moisture was the main factor causing chip delamination during diassemhling process. Chip delamination issue could be solved through sufficient desiccation of circuit boards before diassembling. Destructive physical analysis （DPA） proved that there were no creep deformations or corrosive occurrences, which might cause potential failures, in 4-5 years old chips. It has been demonstrated that the disassembled chip is of great reusable value.

关 键 词：拆解芯片 可重用性 破坏性物理分析 

分 类 号：TM931[电气工程—电力电子与电力传动]