微波印制电路板制造工艺及其电阻集成  

Manufacturing technologies of microwave PCB and resistance integration

作　　者：高能武[1] 曾策[1] 秦跃利[1] 

机构地区：[1]中国电子科技集团公司第29研究所,四川成都610036

出　　处：《电子元件与材料》2009年第11期68-70,共3页Electronic Components And Materials

摘　　要：介绍了微波印制电路板制造工艺中的钻孔、孔金属化和图形制作等主要步骤以及电阻集成的方法。通过在微波印制电路板基材表面涂覆低介电常数的材料,改变了基材表面形貌和特性,采用薄膜工艺在微波印制电路板上集成了30～50Ω/的NiCr电阻。最后简要介绍了微波多层印制电路新技术。The main steps such as the drill, the metalized via bole and the manufacturing graph of manufacturing process of microwave PCB and the methods of resistance integration were introduced. Through modifying the surface morphology and character of the microwave PCB material by coating low permittivity material, the NiCr resistances of 30-50 Ω/ were integrated on the microwave PCB by thin film technologies. Multilayer microwave PCB technology was introduced briefly.

关 键 词：微波印制电路板 电阻集成 表面改性 

分 类 号：TN454[电子电信—微电子学与固体电子学]