ACF互联可靠性影响因素的研究进展  

Progress in research on factors affecting the connecting reliability of anisotropic conductive film

作　　者：罗超云[1] 左建东[2] 林雪春[1] 

机构地区：[1]深圳职业技术学院应用化学与生物技术学院,广东深圳518055 [2]深圳大学材料科学与工程学院,广东深圳518060

出　　处：《电子元件与材料》2009年第11期76-79,共4页Electronic Components And Materials

摘　　要：总结了材料、芯片结构和环境因素等对异向导电胶膜(Anisotropic Conductive Film;ACF)互联可靠性的影响。文献表明,ACF基体树脂的吸湿膨胀系数、粘结强度及玻璃转化温度严重影响组装产品的互联可靠性,而导电粒子的导电性、芯片的结构和焊盘的表面处理方式等对可靠性也有较大影响。文献中的可靠性试验表明,在上面提到的因素中,湿气是影响器件中ACF可靠性的主要因素。Studies about the effects of materials, IC structure and environmental factors on the connecting reliability of anisotropic conductive film （ACF） are reviewed. Past studies show that the coefficient of moisture expansion, the adhesive strength and the glass transition temperature of the matrix resin of ACF significantly affect the connecting reliability of ACF device, while the conductivity of conductive particles, the IC structure and the way finishing the pad surface also have many effects on this issue. Reliability tests reported in past studies indicate that moisture is the main factor affecting the reliability of ACF in device.

关 键 词：复合材料 异向导电胶膜 综述 可靠性 封装技术 

分 类 号：TM249.9[一般工业技术—材料科学与工程]