多主并行处理加固计算机设计和实现  

Design and implementation for multiple master parallel processing rugged computer

作　　者：郑波祥[1] 朱勇[1] 苏培培[1] 

机构地区：[1]江苏自动化研究所,江苏连云港222006

出　　处：《电子技术应用》2009年第11期122-124,共3页Application of Electronic Technique

摘　　要：采用Intel Xeon LV处理器,利用先进的EDA工具和仿真软件进行高速串行总线的合理布局布线,实现了一种支持多主并行处理的加固计算机。根据应用,构建了基于高速互连网络的计算机硬件系统,结合成熟的商用并行软件,对计算机系统并行能力进行了测试;针对抗恶劣环境应用,特别是热设计,通过热分析、建模仿真(Icepak)等手段,实现计算机系统的环境设计。By using Intel Xeon LV processor and by rational layout and wire for high speed serial bus through EDA tools and simulation software, the type of multiple master parallel processing rugged computer is realized.According to application,test for parallel computer finished basing on computer hardware system and mature commercial parallel software. By thermo analysis and module simulation of Icepak,the thermo design for rugged enviromment application is also completed.

关 键 词：并行 加固 高速串行 热分析 

分 类 号：TP303[自动化与计算机技术—计算机系统结构]