金刚石薄膜半导体器件  

Semiconductor Devices of Diamond Films

作　　者：范建兴 陈启秀[1] 

机构地区：[1]浙江大学信电系功率器件研究所

出　　处：《半导体情报》1998年第5期29-35,共7页Semiconductor Information

摘　　要：介绍了金刚石薄膜的性质、当今金刚石薄膜半导体器件的技术、水平和性能。分析了金刚石薄膜作为半导体器件的优异性能、金刚石相对于硅的半导体器件性能的改善和存在的问题，并指出实现金刚石薄膜半导体器件的障碍。In this paper,the characteristics of the diamond films,the technology,the level and the performance of the diamond films semiconductor devices are introduced.The excellent properties of the diamond films as semiconductor devices improvements and problems of the diamond compared with silicon for semiconductor devices are analyzed.The obstacles of realizing the diamond films semiconductor devices are also pointed out.

关 键 词：金刚石薄膜 半导体器件 半导体材料 

分 类 号：TN304.18[电子电信—物理电子学] TN303