湿热存储环境下锡须生长的研究进展  

Research progress on tin whisker growth in dampheat storage environment

作　　者：曾旭[1] 杨杰[1] 贺岩峰[1] 

机构地区：[1]长春工业大学化学工程学院,吉林长春130012

出　　处：《电镀与涂饰》2009年第11期21-22,25,共3页Electroplating & Finishing

摘　　要：介绍了温度、湿度及表面污染程度对锡须成核与生长的影响,并概述了相应的控制措施。结果表明,合适的后处理措施可以有效抑制锡须的生长。The effects of temperature, humidity and pollution degree of surface on the nucleation and growth of tin whisker were introduced and the corresponding control measures were summarized. The results show that the suitable post-treatment measures can effectively inhibit the growth of tin whisker.

关 键 词：锡须 湿热存储环境 控制措施 

分 类 号：TG178[金属学及工艺—金属表面处理]