厚膜混合电路的激光调阻技术  

The Laser Trimming Technology of Thick Film Hybrid Integration Circuit

作　　者：李颖[1] 林洪[1] 陈琳[1] 王雪冰[1] 张娜[1] 张治国[1] 

机构地区：[1]沈阳仪表科学研究院,辽宁沈阳110043

出　　处：《仪表技术与传感器》2009年第B11期202-204,207,共4页Instrument Technique and Sensor

摘　　要：文中重点论述了厚膜混合电路的激光调阻机理、激光调阻系统的结构、调阻工艺及参数、调阻工作程序、切割类型、切槽缺陷分析及合格切槽要求等方面的内容,对厚膜混合电路的激光调阻具有重要的指导意义。laser trimming mechanism of thick film hybrid integration circuit was introduced. Trimming system structure, tech- nological parameters, working program, etching types, etching notch defect analysis and the request for qualified etching notch were also discussd. It is significative to thick film hybrid circuit laser trimming resistor.

关 键 词：激光调阻系统 调阻工艺 工作程序 切槽 

分 类 号：TP216[自动化与计算机技术—检测技术与自动化装置]