新型电容器用高介电常数聚合物研究进展  

Research Progress in Polymers with High Dielectric Constant for New Capacitor

作　　者：赵波[1] 唐先忠[1] 唐翔[1] 闫裔超[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,成都610054

出　　处：《材料导报（纳米与新材料专辑）》2009年第2期332-334,共3页

摘　　要：高介电常数聚合物具有优异的介电性和柔韧性,可以制备高容量有机薄膜电容器等无源器件,近年来受到广泛关注。目前理论和实验研究的热点主要集中在聚合物/无机介电陶瓷、聚合物/导电颗粒复合材料和纯有机聚合物材料。综述了这3种聚合物的高介电机理及研究进展。采用物理、化学方法进行表面修饰改性,掺入导电颗粒及设计具有高度芳环结构聚合物等措施,均可有效提高介电常数、减小损耗。The polymers with high dielectric constant have attracted much attention, and now are applied in passive components such as organic film capacitor because of their superior permittivity and flexibility. Many researches in theory and experiment focus on three kinds of such polymers which are ceramic/polymer, conductive particle/polymer composite materials and pure polymer. The mechanism of high dielectric constant and recent research progress are introduced. Surface modification by physical and chemical methods, doping with conductive particles and design of polymers with high aromatized structure are proved to improve permittivity and decrease loss effectively.

关 键 词：高介电常数 聚合物 复合材料 

分 类 号：TB322[一般工业技术—材料科学与工程] TM533.1[电气工程—电器]