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作 者:陈力春[1] 堵永国[1] 陈兴宇[1] 郑晓慧[1]
机构地区:[1]国防科学技术大学航天与材料工程学院,湖南长沙410073
出 处:《电子元件与材料》2009年第12期64-67,共4页Electronic Components And Materials
摘 要:选择邻苯二甲酸二丁酯(DOP)和聚乙二醇(PEG)作为复合增塑剂,采用流延法制备生瓷带。研究复合增塑剂中PEG和固含量对浆料黏度及生瓷带力学性能的影响。结果表明,复合增塑剂的增塑效果优于单组分增塑剂。随着PEG含量的增加,生瓷带拉伸强度减小,断裂伸长率先增大后减小;生瓷带的拉伸强度和断裂伸长率随固含量的升高而降低。当增塑剂中w(PEG)为30.0%~70.0%,w(固含量)为86.5%~87.3%时,生瓷带拉伸强度约为1.94MPa,断裂伸长率约为12.07%。Using DOP and PEG as compound plasticizers, LTCC green tapes were prepared by tape-casting method. Effects on the slurry viscosity and mechanical properties of LTCC green tapes were studied when the proportion of PEG in compound plasticizers and the solid loading ratio were changed. The results show that the mechanical properties of green tapes are improved obviously after adding compound plasticizers. The tensile strength decreases, whereas the fracture prolongation rate increases firstly and then decreases with the increase of PEG content. When the w(PEG) in the compound plasticizers is 30.0%-70.0% and the solid loading ratio is 86.5%-87.3%, the tensile strength of the green tapes is about 1.94 MPa and the fracture prolongation rate is about 12.07%.
分 类 号:TN604[电子电信—电路与系统]
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