石墨粉表面化学置换镀铜研究  

Study on Plating Copper on the Surface of Graphite Powders by the Method of Chemistry-replacement

作　　者：田建华[1] 陈建[1] 李春林[1] 

机构地区：[1]四川理工学院,四川自贡643000

出　　处：《表面技术》2009年第6期67-69,共3页Surface Technology

摘　　要：以往在石墨粉表面镀铜存在过程复杂、成本高的缺点，为了改变这种状况，采用化学置换镀的方法在石墨粉表面镀铜，观察了镀铜石墨粉的微观形貌，研究了影响化学置换镀铜的主要因素，分析了化学置换镀铜的机理。实验结果表明：在用镀铜石墨粉制备的复合材料中，铜能形成连续的三维网络结构，有利于提高材料的性能；采用铁粉做还原剂时，为了提高镀覆质量，镀液的最佳pH值应为3左右，搅拌速率应控制在40～60r／min，温度应控制在60％左右；与铝、锌相比，铁作还原剂具有镀覆效果好、副反应少、成本低等优点，有利于工业推广。Plating copper on the surface of graphite powders had defect of complex process and high cost in the past, in order to change this status, the method of chemistry-replacement to plate copper on the surface of graphite pow- ders was used, the microstructure of copper-coated graphite powders was watched, the main factors of impacting on plating copper by using the method of chemistry-replacement were researched ; The principle of plating copper by chemistry- replacement was analyzed. The experimental results showed： The copper could form continuous meshwork of three dimensions, which was propitious to enhance the material＇ s performance; In order to enhance the quality of plating copper, the best solution for the pH value was 3 or so when we used iron as reducer, and the stirring speed should be con- trolled in the 40 -60 switches per minute, the reaction temperature should be controlled in 60℃ or so; Comparing to aluminum and zinc, using iron as reducer had the strongpoint of better coating quality, fewer vice reactions and lower cost, which was propitious to spread in industry.

关 键 词：镀铜石墨粉 化学镀铜 复合材料 

分 类 号：TQ153.3[化学工程—电化学工业]