355nm紫外激光加工柔性线路板盲孔的研究  

Study of Blind Holes Drilling on Flexible Circuit Board Using 355nm UV Laser

作　　者：张菲[1] 段军[1] 曾晓雁[1] 李祥友[1] 

机构地区：[1]华中科技大学武汉光电国家实验室,湖北武汉430074

出　　处：《中国激光》2009年第12期3143-3148,共6页Chinese Journal of Lasers

基　　金：国家863计划(SQ2007AA03xk140983)资助课题

摘　　要：采用输出功率10 W的355 nm紫外激光器对4层柔性线路板(FPC)进行了盲孔加工实验。分析了紫外激光与铜箔和聚酰亚胺(PI)相互作用的过程和机理,并模拟出在一定条件下紫外激光与聚酰亚胺和铜箔相互作用时的单脉冲刻蚀深度。研究了不同加工方式对加工质量的影响,得到优化工艺参数为:第一次采用加工功率3.9 W,频率80 kHz,第二次将加工功率降到1.4 W,其他参数不变,此时加工盲孔的效果最为理想,重铸层粗糙度为0.88966μm,孔底粗糙度为1.063μm。给出了孔底表面的扫描电镜(SEM)图和针式台阶仪测量的盲孔底面三维轮廓及切面二维轮廓图。A 10 W and 355 nm Nd：YAG laser is used for the blind hole drilling experiment of a 4 layer flexible circuit board （FPC）. The interaction mechanism with UV laser and copper and polyimide （PI） is analysised,and the etching depth of single pulse under certain conditions on polyimide and copper is simulated. The effects of the processing methods on the micro-drilling quality are investigated and analyzed. Finally,the optimization of process parameters are obtained,that firstly using the power of 3.9 W,the frequency of 80 kHz,then secondly using the power down to 1.4 W with other parameters unchanged. The recast layer roughness and the bottom surface roughness are 0.88966 μm and 1.063 μm respectively. The scanning electron microscope （SEM） photograph,the 3D profile of bottom surface and the 2D profile of section of the blind hole measured by surface profile measuring system are given.

关 键 词：激光技术 激光钻孔 355 nm紫外激光 柔性线路板 盲孔 刻蚀率 

分 类 号：TN249[电子电信—物理电子学]