几种添加剂对陶瓷化学镀铜层性能的影响  

Influences of Several Additives on Performance of Electroless Copper Coating on Ceramics

作　　者：余祖孝[1] 郝世雄[1] 罗宏[1] 将志鹏[1] 

机构地区：[1]四川理工学院材料与化学工程学院材料腐蚀与防护四川省高校重点实验室,四川自贡643000

出　　处：《材料保护》2009年第12期46-48,共3页Materials Protection

基　　金：材料腐蚀与防护四川省高校重点实验室科研基金资助项目(2008CL06)

摘　　要：陶瓷表面金属化处理的传统镀银工艺存在工艺复杂、设备投资大、成本高、耐焊及耐磨性不足等缺点,使用化学镀铜技术可以很好地解决上述问题。用电化学等方法,研究了添加剂亚铁氰化钾、2,2’-联吡啶和L-精氨酸对陶瓷化学镀铜镀液的沉积速度与稳定性、镀层的耐腐蚀性、导电性及结合力的影响。结果表明:用4%AgNO3作为活化剂,代替价格昂贵的PdCl2,效果较好。陶瓷镀铜最佳配方和工艺为:15g/L硫酸铜,10mL/L甲醛,40g/L酒石酸钾钠,pH值12.6,室温,施镀时间1h,无搅拌。添加剂最佳使用量分别为:5mg/L亚铁氰化钾;5mg/L2,2’-联吡啶;10mg/LL-精氨酸以及二元复合添加剂5mg/L2,2’-联吡啶+10mg/LL-精氨酸。所得陶瓷镀铜层呈现光亮的淡粉红色。The influences of additives [K4Fe(CN)6,2,2'-dipyridyl and L-arginine] on the depositing rate and stability of electroless copper bath and the corrosion re-sistance,conduction and adhesion of copper plating were investi-gated using electrochemical methods etc.Results show that 4% AgNO3 can be well used as the activation agent to replace expen-sive PdCl2.The optimum formula for electroless Cu plating was determined as 15 g/L CuSO4,10 mL/L HCHO,40 g/L sodium potassium tartrate;and the optimal plating parameters were deter-mined as pH value of 12.6,room temperature,plating time of 1 h.The dosages of additives were determined as 5 mg/L K4Fe(CN)6,5 mg/L2,2'-dipyridyl,10 mg/L L-arginine,and 5 mg/L 2,2-dipyridyl + 10 mg/L L-arginine.The resulting electroless Cu coating looks bright and light pink.

关 键 词：陶瓷 化学镀铜 活化剂 添加剂 亚铁氰化钾 2 2’-联吡啶 L-精氨酸 性能 

分 类 号：TQ153.14[化学工程—电化学工业]