一种新型的电热驱动MEMS微继电器的研制  

Development of a Novel Electric-Thermal-Driven MEMS Micro-Relay

作　　者：胡志军[1] 陈迪[1] 黄闯[1] 陈翔[1] 朱军[1] 刘景全[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米纳米加工技术国家级重点实验室薄膜与微细技术教育部重点实验室,上海200240

出　　处：《传感技术学报》2009年第12期1696-1700,共5页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金资助(50875169)

摘　　要：设计和制备了一种新型的电热驱动微电子机械(MEMS)继电器,并进行了性能测试。整个工艺采用非硅MEMS工艺,利用Cu作为牺牲层材料,Ni作为微继电器的结构材料。微继电器是基于杠杆放大原理设计的,因此能够获得较大的行程;驱动臂采用"U"型梁设计,能够在不增加功耗的条件下,获得较大的驱动力。并采用Ansys10.0有限元软件对微继电器进行了模拟分析。测试结果表明,这种微型继电器具有体积小、驱动电压低、切换速度快等优点。A novel electric-thermal-driven micro-electronic-mechanical（MEMS） relay was developed, and the performance test was carried out. The non-silicon MEMS fabrication process was used, Cu as sacrifice material and Ni as structural material. The micro-relay can obtain larger travel, which is based on the principle of leverage. The driving arm,utilizing “U”shape-beam design, can produce larger driving force by small power. Ansys10.0 finite element analysis software was used to simulate and analyze. Testing result shows that this novel micro-relay has advantages of small volume, low driving voltage,and fast repetition rate.

关 键 词：MEMS 微继电器 电热驱动 有限元分析 

分 类 号：TN603.5[电子电信—电路与系统] TN405