结构设计中的热控制技术  

Thermal Control Technology in Structure Design

作　　者：王连坡[1] 

机构地区：[1]中国电子科技集团公司第二十八研究所,南京210007

出　　处：《电子机械工程》2009年第6期11-13,34,共4页Electro-Mechanical Engineering

摘　　要：介绍了电子设备热设计的基本要求、目的、传热的基本原则及热量传递的基本方式。结合传热学的理论知识,分析了热控制的机理。从结构设计角度出发,阐述了热控制技术的设计方法;针对在结构设计中对热控制的不同需求,给出了具体的设计方案。提出了热设计与电磁兼容性设计的并行设计思想。This paper introduces the basic requirement, the purpose of thermal design, its basic principle as well as the basic mode of heat transfer of the electronic equipment. The principle of thermal control which is based on heat transfer is analyzed. The way of thermal control technology through structure design is de- scribed. Some valid design methods of thermal control is provided. At the same time, parallel design concepts of thermal design and electromagnetic compatibility design this suggested in this paper.

关 键 词：传热学 热控制 结构设计 热分析 电磁兼容 

分 类 号：TK124[动力工程及工程热物理—工程热物理]