D2-FBGA热循环载荷下的结构参数优化  

Optimization of Structure Parameters of D2-FBGA Under Thermal Cycle Loading

作　　者：赵明君[1] 杨道国[1] 牛利刚[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《微电子学》2009年第6期869-873,共5页Microelectronics

基　　金：国家自然科学基金资助项目(60666002)

摘　　要：利用动态机械分析仪(DMA),测定环氧模塑封材料(EMC)的粘弹性数据;经过数据拟合处理,得到有限元仿真所需的相关参数。将D2-FBGA中芯片厚度、粘结剂厚度、部分EMC厚度及基板厚度作为优化参数,选用正交实验设计,建立了这四个参数的正交表;并用MSC、Marc,计算了D2-FBGA在热循环载荷下的热应力分布。通过统计软件stata,建立了最大等效应力与上述参数的关系的回归方程;分析了各个结构参数对器件最大等效应力的影响程度;使用单纯形法,得出一组最优结构参数及对应的最大等效应力值。结果表明:通过优化,器件的最大等效应力从90.58 MPa下降到66.84 MPa,优化效果明显。Visco-elastic parameters of epoxy molding compound （EMC） were tested by using dynamic mechanical analyzer （DMA）. Relevant parameters of finite elements were acquired from data simulation. Thicknesses of chip, adhesive agent, partial EMC and substrate of D2-FBGA, considered as optimization parameters, were selected to establish orthogonal table. With MSC and Marc, thermal stress distribution of D2-FBGA was previewed under thermal cycle loading. A regression equation for maximum equivalent stress and the above-mentioned parameters was built through statistical software Stats Effect of those parameters on maximum equivalent stress was analyzed. A set of optimal structure parameters and the corresponding maximum equivalent stress value were obtained using simplex method. Results showed that the maximum equivalent stress of the device decreased from 90. 58 MPa to 66.84 MPa after optimization.

关 键 词：动态机械分析仪 正交实验设计 回归分析 热循环 

分 类 号：TN406[电子电信—微电子学与固体电子学]