倒装焊机中视觉系统的应用及对位算法研究  

Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine

作　　者：张永聪[1] 田亚炜[1] 于敬凯[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2009年第12期33-35,共3页Equipment for Electronic Products Manufacturing

摘　　要：倒装焊是一种采用芯片与基板直接安装的互连工艺方法,使封装具有更优越的高频、低延迟、低串扰的电路特性。通过视觉系统优化及对位算法,极大地提高了生产效率和对位精度。Flip chip bonding is the interlinkage technics method of fixing directly the chip and subsirate, with the circuit identity of encapsulation is more superiority, which consists of high frequency, low delay and crossfeed. The efficiency of the production and the contrapuntal precision can be improved greatly by optimizing the vision system and using the contrapuntal arithmetic.

关 键 词：倒装焊 视觉系统 算法 

分 类 号：TP271.5[自动化与计算机技术—检测技术与自动化装置]