一种厚膜电容式压力敏感芯片  

Thick Film Capacitive-sensitive Chips

作　　者：常慧敏[1] 李民强[1] 王英先[1] 关柯[1] 高理升[1] 

机构地区：[1]中国科学院合肥智能机械研究所,安徽合肥230031

出　　处：《仪表技术与传感器》2009年第11期14-16,共3页Instrument Technique and Sensor

摘　　要：厚膜电容式压力敏感芯片具有工作温度范围宽、耐腐蚀、抗过载能力强、蠕变和迟滞小等优点。该芯片是由2块能牢固键合成一体的上下基板组成,基板材料为96%Al2O3陶瓷。下基板既为弹性体,又为电容器的可动电极;上基板为电容器的固定电极并可承载运放、信号调节电路。文中研制的压力敏感芯片量程为0-100 kPa,电容值为30 pF,非线性为1.5%,工作温度为-40-125℃,零点温漂小于200 ppm/℃.Thick-film capacitive pressure-sensitive chip has many advantages,such as wide operation temperature range,corrosion-resisting,strong anti-overload ability,and the slow hysteresis.It is especially suitable for measurement of oil tank liquid level.The chips comprised of two substrates synthesized into one firmly,this substrate is made of 96% Al2O3.The below substrate both elastomers,but also movable electrode of capacitor;the above one is a fixed electrode which can bear operational amplifier and signal conditioning circuit.and pressure range from 0 to 100 kPa,the capacitive is about 30 pF,accurate to 1.5% linearity,and operation temperature is-40 ℃ to ＋125 ℃,zero thermal shift is less than 200 ppm/ ℃.

关 键 词：厚膜 电容式 压力敏感芯片 

分 类 号：TP212.1[自动化与计算机技术—检测技术与自动化装置]