氮化铝陶瓷表面化学镀铜溶液组成的优化  

Optimization of bath composition for electroless copper plating on aluminum nitride ceramic surface

作　　者：王晓虹[1] 张金强[1] 冯培忠[1] 孙智[1] 

机构地区：[1]中国矿业大学材料科学与工程学院,江苏徐州221116

出　　处：《电镀与涂饰》2009年第12期25-27,共3页Electroplating & Finishing

基　　金：江苏省自然科学基金(DK2004032);中国矿业大学青年科研基金(2008A046)

摘　　要：采用正交试验方法研究了镀液组成对氮化铝(AlN)陶瓷表面化学镀铜镀速和表面粗糙度的影响。经过直观分析和方差分析,评价了各组分对化学镀影响的显著程度,优化了镀液组成。试验结果表明,CuSO4·5H2O和Na2EDTA对镀速有显著影响;KNaC4H4O6、CuSO4·5H2O和Na2EDTA对镀后表面粗糙度有显著影响;AlN陶瓷表面化学镀铜液的最优工艺参数为:CuSO4·5H2O24g/L,Na2EDTA30g/L,KNaC4H4O620g/L和HCHO15mol/L。在最优工艺条件下,镀速为7.350μm/h,镀后表面粗糙度为1.03μm,所得镀层表面平整,铜晶粒大小均匀。The effect of bath composition of electroless copper plating on aluminum nitride （AlN） ceramic surface on the plating speed and surface roughness was studied by orthogonal test. The influence degree of individual component on electroless plating was estimated by intuitive and variance analysis, and the bath composition was optimized. The test results showed that CHSO4·5H2 O and Na2EDTA have a remarkable effect on the plating speed, and KNaC4H4O6, CuSO4·5H2O and Na2EDTA have a great influence on the surface roughness. The optimal process parameters of the bath for electroless copper plating on AlN ceramic surface are as follows： CuSO4·5H2O 24 g/L, Na2EDTA 30 g/L, KNaC4H4O6 20 g/L and HCHO 15 mL/L. In the optimal conditions, the plating speed is 7.350 μm/h, the surface roughness of deposit is 1.03 μm and an level surface and uniform grain size of copper were observed.

关 键 词：氮化铝 陶瓷 化学镀铜 正交试验 优化 

分 类 号：TQ174.758[化学工程—陶瓷工业]