欠键合/过键合与功率设置及温度关系的研究  

Study on the Relation Between Under-Bonding/Over-Bonding and Power Setting & Temperature

作　　者：张亚楠[1] 韩雷[1] 

机构地区：[1]中南大学现代复杂装备设计与极端制造教育部重点实验室,长沙410083

出　　处：《半导体技术》2010年第1期84-89,共6页Semiconductor Technology

基　　金：国家重点基础研究发展计划(973)项目(2009CB724203)

摘　　要：在热超声引线键合过程中,低功率设置和低温下容易导致欠键合,高功率设置和高温下则容易出现过键合。通过实验采集了不同超声功率设置、不同温度下大量键合过程中换能杆末端轴向的速度信号、换能杆两端驱动电压和电流信号,并测量其键合强度,计算得到不同温度下换能杆的振幅。分析了超声功率和键合温度对振幅的影响规律,解释了功率设置和键合温度导致欠键合和过键合的可能原因,建立了功率设置和温度对换能杆振幅影响的模型。这些实验数据和结果有助于进一步研究键合过程中参数间的相互影响规律。In thermosonic wire bonding process, the bonding power setting and bonding temperature are important factors to the vibration of transducer system and the bonding quality. Low power setting and temperature may result in under-bonding, however, high power setting and temperature may contribute to under-bonding. In a number of bonding experiments at different power setting and temperature setting, vibration velocity at the tip of transducer and its driving voltage, current were monitored, then their bonding strength was obtained. Driving power and vibration amplitude were obtained by calculating. The influence laws were analyzed. The possible reason how power setting and temperature brought about under-bonding and over-bonding was analyzed. A model about influence of power setting and temperature on vibration amplitude was built. These experimentally obtained data and results could conduce to further studying about the interaction of bonding parameters.

关 键 词：热超声键合 键合温度 键合功率 欠键合 过键合 换能杆 

分 类 号：O426.9[理学—声学] TB559[理学—物理]