Sn-Zn-Al-P系无铅焊料物理性能研究  

Study on Physical Properties of Sn-Zn-Al-P Lead-free Solder

作　　者：皮苗苗[1] 张修庆[1] 张海娟[1] 赵祖欣[1] 叶以富[1] 

机构地区：[1]华东理工大学机械与动力工程学院承压系统安全科学教育部重点实验室,上海200237

出　　处：《热加工工艺》2010年第1期24-26,32,共4页Hot Working Technology

基　　金：上海市重点学科建设项目资助(B503)

摘　　要：在Sn-Zn系无铅焊料的基础上,通过添加合金元素Al和P制备出不同成分的无铅焊料,研究了其无铅焊料的物理性能。结果表明:通过加入适量合金元素Al和P的Sn-Zn-Al-P系无铅焊料在基本上不影焊料响熔点的前提下,可以减小密度,降低成本,提高其导电性能和润湿性。The different weight percentages of Sn-Zn-Al-P lead-free solders were processed by adding alloying elements AI and P. The physical properties of Sn-Zn-Al-P lead-free solders were researched. The results show that appropriate amount of alloying elements Al and P of Sn-Zn-Al-P lead-free solders can reduce the density to cut the costs and improve conductive property and wetting ability without the effect of melting point of Sn-Zn-Al-P lead-free solders.

关 键 词：无铅焊料 熔点 导电性能 润湿性 

分 类 号：TG425[金属学及工艺—焊接]