焊膏SnAgCu焊锡微粉在有机酸溶液中的腐蚀与防护  

Corrosion and Protection of SnAgCu Solder Powders in Organic Acid Solutions

作　　者：李涛[1] 赵麦群[1] 卢加飞[1] 薛静[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《材料保护》2010年第1期13-15,共3页Materials Protection

基　　金：陕西省自然科学研究计划资助项目(2002E111)

摘　　要：电子产品多用焊膏焊接,其黏度稳定性常受某些酸性物质的腐蚀而下降,进而导致可焊性下降。研究了SnAgCu无铅焊锡微粉在0.1mol/L乙二酸水溶液和0.1mol/L乙二酸乙醇溶液中的常温腐蚀行为,以及添加16mmol/L缓蚀剂苯并三唑(BTA)对其腐蚀行为的影响,并对微粉的腐蚀与缓蚀机制进行了分析。结果表明:焊锡微粉在乙二酸水溶液中的腐蚀程度比在同浓度的乙二酸乙醇溶液中更为严重,且在乙二酸水溶液中微粉表面出现大量均匀分布的腐蚀沟槽,而在乙二酸乙醇溶液中只有少量点蚀痕迹;微粉表面的富锡相易被腐蚀;焊膏中加入BTA对焊锡微粉有良好的缓蚀保护作用,由此使焊膏黏度的稳定性得到保证。The corrosion behavior of lead-free SnAgCu solder pow-ders in aqueous and ethanol solutions of 0.1 mol/L oxalic acid was evaluated.The effect of organic inhibitor 1,2,3-benzotriazole (BTA,16 mmol/L) on the corrosion resistance of the solder powders was studied by conducting immersion corrosion test at room temperature.Moreover,the micro-morphology of the pow-ders was observed by using a scanning electron microscope (SEM),and the corrosion and inhibition mechanisms of the pow-ders were analyzed.Results indicate that the solder powders have experienced more severe corrosion in the aqueous solution of oxal-ic acid than in the ethanol solution of oxalic acid at the same con-centration.A large number of corroded grooves were formed on the surface of the solder powders in the aqueous solution of oxalic acid,while only a few pitted spots were formed thereon in the ethanol solution of oxalic acid.At the same time,the tin-rich phase on the surface of the solder powders was more Liable to cor-rosion.And BTA was able to effectively prevent the solder pow-ders from corrosion in both aqueous and ethanol solutions of oxalic acid,contributing to the maintenance of good viscosity stability of the lead-free solder powders.

关 键 词：无铅焊锡微粉 锡银铜 腐蚀 缓蚀剂 有机酸 腐蚀行为 

分 类 号：TG174.42[金属学及工艺—金属表面处理]