超细晶镍钴合金的电铸工艺  

Technology for Electroforming of Ultra-Fine Grain Ni-Co Alloy

作　　者：张俊[1] 裴和中[1] 张国亮[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《材料保护》2010年第1期36-37,共2页Materials Protection

基　　金：国防科工委军品配套项目(JPPT-115-2-676)

摘　　要：为了进一步提高金属的硬度和强度,采用电铸工艺通过添加剂TN2提高阴极过电位,抑制晶粒生长,制备了超细晶镍钴合金层,研究了电流密度和添加剂TN2对铸层晶粒大小的影响。结果表明:提高电流密度可以细化晶粒,当电流密度从5A/dm2增加到15A/dm2时,晶粒大小从5μm细化到500nm;添加0.15g/LTN2时,铸层表面半光亮,晶粒进一步细化(小于500nm),硬度高达60HRC。Ni-Co alloy coating was prepared by using electro-forming technology.The effects of current density and additive TN2 on the grain size of the alloy coating were studied by means of scanning electron microscopy and X-ray diffraction.Results show that increasing current density leads to refined grains.As the current density increased from 5 A/dm2 to 15 A/dm2,the grain size decreased from 5 μm to 500 nm.The alloy coating ob-tained in the presence of 0.15 g/L additive TN2 had zero stress and semi-bright surface.And its grain size was smaller than 500 nm,while its hardness was as high as 60 HRC.

关 键 词：扫描电镜 X射线衍射 晶粒大小 电流密度 添加剂 超细晶 

分 类 号：TQ153.4[化学工程—电化学工业]