连铸结晶器铜板电镀层的研究进展  

Research Advances in Copper-based Electroplated Layer of Continuous Casting Mold

作　　者：吕春雷[1] 曹为民[1] 印仁和[1] 郁祖湛[2] 侯峰岩[3] 

机构地区：[1]上海大学理学院,上海200444 [2]复旦大学化学系,上海200433 [3]上海宝钢设备检修有限公司宝钢机械厂,上海201900

出　　处：《电镀与精饰》2010年第1期15-19,共5页Plating & Finishing

基　　金：上海市教委第五期重点学科赞助J50102

摘　　要：连铸结晶器表面要求具有高硬度、高耐磨、高耐蚀性能及良好的导热性,在铜基体上通过表面处理技术涂镀各种镀层能显著改善表面性能,获得优异的表面质量。对提高结晶器使用寿命的多种表面处理技术,特别是对电镀单金属、二元合金、三元合金及复合镀层表面处理技术的研究进展进行了评述。High hardness,wear resistance and corrosion resistance and good thermal conductivity are required as basic characteristics for Continuous Casting Mold.The surface performance is greatly increased by means of coating metals and alloys on copper substrate.The current progress of several surface treatment technologies is reviewed,such as single metal plating,binary alloy,ternary alloy and composite plating which all improve the working life of Continuous Casting Mold.

关 键 词：连铸结晶器铜板 合金镀层 表面技术 

分 类 号：TQ153[化学工程—电化学工业]