基于弯曲测试技术的纳米梁厚度的精密测量  

Precision Measurement of Nanobeam Thickness Using Bending Test

作　　者：徐临燕[1] 栗大超[1] 刘瑞鹏[2] 傅星[1] 胡小唐[1] 张文栋[3] 

机构地区：[1]天津大学精密测试技术及仪器国家重点实验室,天津300072 [2]天津航海仪器研究所质标处,天津300131 [3]中北大学电子测试技术国家重点实验室,太原030051

出　　处：《纳米技术与精密工程》2010年第1期7-11,共5页Nanotechnology and Precision Engineering

基　　金：科技部国际科技合作与交流专项资助项目(2008DFA71610);国家自然科学基金重点资助项目(50535030)

摘　　要：针对广泛应用的扫描电镜和台阶仪在测量纳米厚度时存在的破坏性和近似性等局限性,提出了一种基于弯曲测试技术实现纳米梁厚度精密测量的方法.该方法的核心思想是悬浮结构在载荷的作用下产生初始弯曲直至其下表面与衬底接触的过程中形成的载荷-位移曲线会出现斜率明显不同的两个直线段,其交点代表了悬浮结构下表面与衬底之间的初始接触,由此可测量出该悬浮结构下表面与衬底之间的间隙,从而间接得到结构的厚度值.分别采用原子力显微镜(AFM)和纳米压痕仪作为测试平台对单晶硅固支纳米梁进行了厚度测量,两种测量仪器得到了一致性较好的测量结果.讨论了测量随机误差、系统误差以及数据计算误差等对测试结果的影响和相应的误差降低方法.As nano thickness measurement with SEM and sidestep apparatus has the limitation of approximation and destructive effect, a precise measurement method for nanobeam thickness based on bending test was proposed. The key point of the proposed method is that a turning point will show up in the forcedisplacement curve of the suspending nanobeam under a load force when the lower surface of the beam contacts the substrate. The relative distance between the initial bending point and the turning point is the gap between the lower surface of the nanobeam and the substrate, and the thickness of the suspending nanobeam can be calculated consequently. Thickness of single-crystal silicon clamped nanobeam was measured using AFM and nanoindenter, which shows consistent measuring results. Effect of the random error, system error and calculation error on the measurement and corresponding ways to cure the errors have also been discussed.

关 键 词：纳米梁 厚度 原子力显微镜 纳米压痕 弯曲测试 

分 类 号：TH821.1[机械工程—仪器科学与技术]