硅烷化过程中不同加热温度对瓷和树脂粘接强度的影响  

Effect of heated silanization on the bond strength between ceramic and resin composite

作　　者：王迎捷[1] 陈吉华[2] 李雅卿[2] 周强[1] 

机构地区：[1]第四军医大学口腔医学院综合急诊科,西安710032 [2]第四军医大学口腔医学院修复科,西安710032

出　　处：《现代口腔医学杂志》2010年第1期42-44,共3页Journal of Modern Stomatology

摘　　要：目的比较硅烷化过程中不同加热温度对瓷和树脂粘接强度的影响。方法选用2种不同类型硅烷偶联剂处理瓷表面,分别在20℃,40℃,60℃,80℃,100℃条件下干燥5m in。将经过表面处理的瓷试件与树脂粘接并测试剪切强度。结果20℃～60℃范围内,随加热温度的提高,瓷和树脂粘接强度上升;60℃～100℃范围内,随加热温度的提高,粘接强度下降。结论将硅烷化过程中加热温度提高至60℃左右时,硅烷偶联剂能够在瓷和树脂之间产生最佳粘接强度。Objective To evaluate the effect of heated silanization on the bond strength between ceramic and resin composite.Methods Two different silane coupling agents were applied onto the ceramic surface respectively,then heated at different temperature（20℃,40℃,60℃,80℃,100℃）.Resin composite was bonded with ceramic.Then the shear bond strengths were evaluated.Results From 20℃ to 60℃,the bond strengths were improved as temperature increased;further the temperature increased,the bond strengths decreased.Conclusion About 60℃ heating during silanization could significantly improve the bond strength between ceramic and resin composite.

关 键 词：瓷 复合树脂 硅烷化 加热 粘接强度 

分 类 号：R783.2[医药卫生—口腔医学]