粒度配比法制备近全致密W/Cu20复合材料(英文)  

Fabrication of W/Cu20 Composite Materials with Nearly Full Density by Particle Size Distribution Method

作　　者：刘彬彬[1,2] 陈江华[1] 谢建新[2] 

机构地区：[1]湖南大学,湖南长沙410082 [2]北京科技大学,北京100083

出　　处：《稀有金属材料与工程》2010年第1期17-21,共5页Rare Metal Materials and Engineering

基　　金：National Outstanding Young Scientist Foundation of China (50125415)

摘　　要：选用A、B两种不同粒度的W粉,调节A、B钨粉的比例,并与Cu粉直接混合,配制成W/Cu20(质量分数%,下同)混合粉末,经热压制备了近全致密的W-Cu复合材料。显微组织观察表明,随着小粒度W粉配比的增加,大W颗粒形成的孔隙逐渐减少,而小W颗粒形成的孔隙逐渐增加。当W粒度配比为80%A+20%B时,形成较为致密的堆积结构。在合适的工艺条件下(烧结温度1060℃、压力85MPa、保温3h),所制备的W/Cu20复合材料其相对密度达到98.6%,Cu相沿大W颗粒和小W颗粒的边界呈现网状分布。In order to fabricate highly dense W/Cu20 （mass fraction, similarly hereinafter） composite materials, two kinds of tungsten powder with different particle size, A and B, were used. The W powder with different ratios of A and B were directly mixed with copper powder and W/Cu20 mixed powder was obtained. Almost fully dense W-Cu composite materials were fabricated by solid-state hot pressing. The observation of microstructure shows that with increasing of the fine W powder （B） content, the pores formed by the coarse W powder （A） decrease and the pores by the fine W powder increase gradually. Rather dense microstructure is obtained when the W particle distribution is 80%A＋20%B. The W/Cu20 with 98.6% relative density is obtained under the processing conditions of sintering temperature of 1060℃, pressure of 85 MPa and holding time of 3 h. Copper forms into a network structure around the coarse W particles and the fine W particles.

关 键 词：粒度配比 热压 钨铜复合材料 相对密度 热沉材料 

分 类 号：TB331[一般工业技术—材料科学与工程]