直流电沉积Ni-W-P镀层研究  

Study on Direct-Current Electroplated Ni-W-P Layer

作　　者：刘殿龙[1] 杨志刚[1] 刘璐[1] 张弛[1] 

机构地区：[1]清华大学先进材料教育部重点实验室,北京100084

出　　处：《稀有金属材料与工程》2010年第1期60-64,共5页Rare Metal Materials and Engineering

摘　　要：采用直流电沉积法,在低碳钢表面成功沉积Ni-W-P镀层。应用X射线荧光(XRF)、扫描电子显微镜(SEM)、俄歇电子能谱(AES)、X射线衍射(XRD)仪等方法,研究电流密度、镀液pH值和镀液温度对Ni-W-P镀层成分、表面形貌和结构的影响。结果表明,电流密度和镀液pH值的变化对Ni-W-P镀层成分的影响很大,而电流密度、镀液pH值和温度对镀层厚度的影响较小。电流效率随着电流密度和镀液温度的增大分别降低和升高,而随着镀液pH值的变化,在pH=7.0时有极大值。镀液pH值对Ni-W-P镀层结构有较大影响,在pH=8.0时,镀层呈现明显的Ni(111)峰,此时镀层硬度达到极大值7130MPa。在此基础上,对Ni-W-P镀层的电沉积机制做了进一步探讨。Ni-W-P layers were formed on a low-carbon steel substrate by direct-current electroplating method. The effects of current density, pH value and bath temperature on the composition, surface morphology, and microstructure of Ni-W-P layers were studied by X-ray fluorescence （XRF）, scanning electron microscope （SEM）, auger electron spectroscopy （AES） and X-ray diffraction （XRD）. The results indicate that the change of current density and pH value influenced the composition of Ni-W-P layer greatly, but the change of current density, pH value and bath temperature hardly influenced the thickness of Ni-W-P layer. As current density and bath temperature increased, current efficiency decreased and increased, respectively, and current efficiency reached the maximum value when pH value is 7.0. The structure of Ni-W-P layer was greatly influenced by pH value, and a well-preferred orientation along Ni （111） direction was shown when pH value was 8.0. Synchronously, the microhardness of Ni-W-P layer reached the maximum value of 7130 MPa. At last, electroplating mechanism of Ni-W-P layer was discussed further

关 键 词：Ni-W-P镀层 电流密度 PH值 镀液温度 

分 类 号：TG174.4[金属学及工艺—金属表面处理]