碱性无氰预镀铜工艺研究  

Study on Copper Strike Electroplating Technology in Alkaline Cyanide-free Bath

作　　者：胡德意[1] 袁艳伟[1] 刘保[1] 郭淑玲[1] 王金玲[1] 

机构地区：[1]江南机器集团有限公司科技部,湖南湘潭411207

出　　处：《电镀与精饰》2010年第2期11-14,共4页Plating & Finishing

摘　　要：研究了一种镀层与基体具有良好结合力、电解液分散能力和覆盖能力好的碱性无氰预镀铜工艺,探讨了溶液成份、工艺参数对镀层质量影响。着重测定了电解液的性能如阴极电流效率、分散能力及深镀能力以及添加剂对阴极极化的影响等,同时还测定了镀层与基体的结合力。An alkaline cyanide-free copper strike electroplating technology with excellent adhesion, good throwing and covering ability was investigated. Effects of bath composition and technology parameters on the quality of the copper plating were discussed. The present study is focused on the measurements of the properties of the platings and the performance of the electroplating bath, such as cathodic polarization characteristics, anodic polarization characteristics, cathodic current efficiency, throwing and covering ability of the bath and so on.

关 键 词：电镀 无氰 预镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]