基于ANSYS耦合场分析的电器装置温度场仿真  

Thermal Field Simulation of Electrical Apparatus Based on ANSYS Coupled Field Analysis

作　　者：丁斌[1] 杨宁[1] 王志萍[1] 

机构地区：[1]上海电力学院电力系统及自动化学院,上海200090

出　　处：《低压电器》2010年第2期9-12,共4页Low Voltage Apparatus

基　　金：上海市科委科技攻关项目(08240512000)

摘　　要：ANSYS有限元软件提供的多物理场耦合求解方法能够有效地运用于电器装置的温度场仿真分析。详细地描述了利用ANSYS/MultiPhysics进行涡流场-气流场-温度场耦合分析的关键过程,并以8 000 A高压封闭母线的温升计算为例,验证了仿真结果与试验数据非常接近,误差小于1.6℃。The multiphysics coupled field analysis method can be effectively used for the simulation of temperature field of electrical apparatus. The key procedure of coupled magneto-fluid-thermal field analysis in ANSYS/ MuhiPhysics program was described in details. Taking the temperature rise of an 8 000 A high voltage enclosed busbar as an example, the simulation result was close to the experimental data with the error less than 1.6 ℃.

关 键 词：电涡流 流场 温度场 耦合场分析 电器装置 

分 类 号：TM502[电气工程—电器]