反应磁控溅射法制备(Ti,Al)N薄膜的力学性能  被引量:5

Mechanical Properties of (Ti,Al)N Films Deposited by Reactive Magnetron Sputtering

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作  者:周滔[1] 聂璞林[1] 李铸国[1] 黄坚[1] 蔡珣[1] 

机构地区:[1]上海市激光制造与表面改性重点实验室上海交通大学,上海200240

出  处:《中国表面工程》2010年第1期34-38,共5页China Surface Engineering

摘  要:采用镶嵌靶反应磁控溅射技术,通过调节氮分压及基体偏压在M2高速钢基体表面制备了一系列耐热的(Ti,Al)N硬质薄膜,并用XRD,EDS及纳米压入法、划痕法等方法研究了(Ti,Al)N薄膜的成分、相结构与力学性能的关系。结果表明,氮分压和基体偏压对(Ti,Al)N薄膜取向及Ti、Al、N原子含量有明显影响,从而导致薄膜硬度及膜基结合性能发生变化。研究中,在氮分压为33.3×10-3Pa、基体偏压为-100V时制备的(Ti,Al)N薄膜力学性能最优,其纳米硬度为43.4GPa,达到40GPa超硬薄膜的要求。The (Ti,A1)N films were deposited by direct current (DC) reactive magnetron sputtering using Ti-AI mosaic target on M2 high speed steel. In the deposition, the nitrogen partial pressure and substrate bias were adjusted for optimizing the deposition process and obtaining good mechanical properties. The composites, structures and mechanical properties of the deposited films were investigated using XRD, EDS, nanoindentation and scratch tests. The results show that the nitrogen partial pressure and substrate bias influence the orientation and composition (Ti, A1 and N atoms) of the film. Therefore the hardness and interracial adhesion of the films are influenced by the deposition details. In this study, the highest hardness of the film was 43.4 GPa, which was obtained in the process of 33.3 × 10^-3 Pa N2 partial pressure and -100 V bias voltage. The value satisfies the standard of super-hard films (〉40 GPa).

关 键 词:(Ti Al)N薄膜 磁控溅射 氮分压 基体偏压 力学性能 

分 类 号:TG174.444[金属学及工艺—金属表面处理]

 

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